Banker Wire IPZ-25 Architectural Wire Mesh

A simple, lightweight, and modestly priced intercrimp/plain architectural wire mesh design that utilizes the strength of stainless steel to best advantage.‎ Utilizing different wire diameters for the warp and shute to achieve balanced stiffness in both directions, the intercrimp surface gives the material a high degree of reflective energy.‎ A beautiful contrast occurs when mixing a copper based alloy (Bronze, Brass, or Copper) with the stainless warp wires.‎ The difference in color as well as the difference of diameter makes the IPZ-25 an exciting wire mesh to design with.‎ Pattern Details Percent Open Area: 53.‎9% Overall Thickness: 0.‎098" Crimp Style: I3PLZ Aspect Ratio: 2.‎57:1 Opening Limitation: 0.‎080" Weight in Plain Steel: 0.‎83 lbs.‎/sq.‎ ft.‎‎ Available Raw Materials Stainless Steel Stainless Steel / Brass Combination Stainless Steel / Bronze Combination Stainless Steel / Copper Combination Available Secondary Finishes US10A Further info from manufacturer on IPZ-25 Banker Wire